838 Plus High Precision IC Ball Bonder

Application


IC (SOT、SOP、DIP、BGA、QFN、DFN、COB  Class )


Technical advantages


◆ Fully enclosed nitrogen protection function
◆ High performance workbench with positioning accuracy of ± 1 µ m
◆ Full closed-loop force control system, achieving_ ± 1g precise dynamic welding force control
◆ High performance image processing function, which can achieve multi-stage positioning of chips and pins
◆ High performance dual frequency ultrasonic welding head, achieving good process control of multiple materials
◆ Able to achieve 90mm wide bracket welding
◆ Automatic program import function, quickly completing multi line programming
◆ It can achieve multi machine networking and remote monitoring


Specification parameters